CAPEL FPC & Flex-Rigid PCB Production Capability
| Produkt | Hege tichtens | |||
| Interconnect (HDI) | ||||
| Standert Flex circuits Flex | Flat fleksibele circuits | Rigid Flex Circuit | Membraan Switches | |
| Standert Panel Grutte | 250 mm x 400 mm | Rol formaat | 250 mm x 400 mm | 250 mm x 400 mm |
| line breedte en Spacing | 0.035 mm 0.035 mm | 0.010"(0.24mm) | 0.003"(0.076 mm) | 0.10"(.254 mm) |
| Koper dikte | 9um / 12um / 18um / 35um / 70um / 100um / 140um | 0.028mm-.01mm | 1/2 oz.en heger | 0.005"-.0010" |
| Laach Count | 1-32 | 1-2 | 2-32 | 1-2 |
| VIA / DRILL SIZE | ||||
| Minimum drill (meganyske) gat diameter | 0,0004" (0,1 mm) 0,006" (0,15 mm) | N/A | 0.006" (0.15 mm) | 10 mil (0.25 mm) |
| Minimum Via (laser) Grutte | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 mm) | N/A |
| Minimum Micro Via (laser) Grutte | 3 mil (0.076 mm) 1 mil (0.025 mm) | N/A | 3 mil (0.076 mm) | N/A |
| Stifter Materiaal | Polyimide / FR4 / Metaal / SUS / Alu | HÚSDIER | FR-4 / Poyimide | PET / Metal / FR-4 |
| Shielding Materiaal | Koper / silver Lnk / Tatsuta / Carbon | Sulveren folie / Tatsuta | Koper / Silver Ink / Tatduta / Carbon | Sulveren folie |
| Tooling Materiaal | 2 mil (0.051 mm) 2 mil (0.051 mm) | 10 mil (0.25 mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| Zif Tolerânsje | 2 mil (.051 mm) 1 mil (0.025 mm) | 10 mil (0.25 mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| SOLDERMASK | ||||
| Soldermaskerbrêge Tusken Dam | 5 mil (.013 mm) 4 mil (0.01 mm) | N/A | 5 mil (0.13 mm) | 10 mil (0.25 mm) |
| Solder Mask Registraasje Tolerânsje | 4 mil (.010 mm) 4 mil (0.01 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| COVERLAY | ||||
| Coverlay Registraasje | 8 mil 5 mil | 10 mil | 8 mil | 10 mil |
| PIC registraasje | 7 mil 4 mil | N/A | 7 mil | N/A |
| Solder Mask Registraasje | 5 mil 4 mil | N/A | 5 mil | 5 mil |
| Oerflakte ôfwurking | ENIG/Immersion Silver/Immersion Tin/Gold Plating/Tin Plating/OSP/ ENEPIG | |||
| Leginde | ||||
| Minimum hichte | 35 mil 25 mil | 35 mil | 35 mil | Grafyske Overlay |
| Minimale breedte | 8 mil 6 mil | 8 mil | 8 mil | |
| Minimum romte | 8 mil 6 mil | 8 mil | 8 mil | |
| Ynskriuwing | ± 5 mil ± 5 mil | ±5 mil | ±5 mil | |
| Impedânsje | ±10% ±10% | ± 20% | ±10% | NA |
| SRD (Stiel Rule Die) | ||||
| Outline Tolerânsje | 5 mil (0.13 mm) 2 mil (0.051 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Minimum radius | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Binnen Radius | 20 mil (0.51 mm) 10 mil (0.25 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| Punch Minimum Hole Grutte | 40 mil (10.2 mm) 31.5 mil (0.80 mm) | N/A | N/A | 40 mil (1,02 mm) |
| Tolerânsje fan Punch Hole Grutte | ± 2 mil ( 0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil (0.051 mm) |
| Slot Breedte | 20 mil (0.51 mm) 15 mil (0.38 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| Tolerânsje fan gat te sketsen | ±3 mil ± 2 mil | N/A | ±4 mil | 10 mil |
| Tolerânsje fan gat râne nei skets | ± 4 mil ± 3 mil | N/A | ±5 mil | 10 mil |
| Minimum fan Trace te skets | 8 mil 5 mil | N/A | 10 mil | 10 mil |
CAPEL PCB Production Capability
| Technyske parameters | ||
| Nee. | Projekt | Technyske yndikatoaren |
| 1 | Laach | 1-60 (laach) |
| 2 | Maksimum ferwurkjen gebiet | 545 x 622 mm |
| 3 | Minimumboarddikte | 4 (laach) 0,40 mm |
| 6 (laach) 0.60mm | ||
| 8 (laach) 0,8 mm | ||
| 10 (laach) 1.0mm | ||
| 4 | Minimum line breedte | 0.0762 mm |
| 5 | Minimum ôfstân | 0.0762 mm |
| 6 | Minimum meganyske diafragma | 0.15 mm |
| 7 | Hole muorre koper dikte | 0.015 mm |
| 8 | Metallized aperture tolerânsje | ± 0,05 mm |
| 9 | Non-metallisearre aperture tolerânsje | ± 0.025 mm |
| 10 | Hole tolerânsje | ± 0,05 mm |
| 11 | Dimensionale tolerânsje | ± 0.076 mm |
| 12 | Minimum solder brêge | 0.08mm |
| 13 | Isolaasje ferset | 1E+12Ω (normaal) |
| 14 | Plate dikte ratio | 1:10 |
| 15 | Thermyske skok | 288 ℃ (4 kear yn 10 sekonden) |
| 16 | Ferfoarme en bûgd | ≤0,7% |
| 17 | Anti-elektrisiteit sterkte | ~1.3KV/mm |
| 18 | Anti-stripping sterkte | 1.4N/mm |
| 19 | Solder resist hurdens | ≥6H |
| 20 | Flammefertraging | 94V-0 |
| 21 | Impedânsje kontrôle | ± 5% |
CAPEL PCBA Production Capability
| Kategory | Details | |
| Trochrintiid | 24 oeren Prototyping, de levertiid fan lytse batch is sawat 5 dagen. | |
| PCBA Kapasiteit | SMT patch 2 miljoen punten / dei, THT 300.000 punten / dei, 30-80 oarders / dei. | |
| Components Service | Turnkey | Mei folwoeksen en effektyf komponint oanbesteging behear systeem, wy tsjinje PCBA projekten mei hege-kosten prestaasjes.In team fan profesjonele oanbestegingsingenieurs en betûft oanbestegingspersoniel is ferantwurdlik foar de oankeap en behear fan komponinten foar ús klanten. |
| Kitted of Consigned | Mei in sterk oanbestegingsbehearteam en komponint supply chain, Klanten jouwe ús mei komponinten, wy dogge it gearkomste wurk. | |
| Combo | Akseptearje komponinten as spesjale komponinten wurde levere troch klanten.en ek komponinten boarnen foar klanten. | |
| PCBA Solder Type | SMT, THT, as PCBA soldering tsjinsten beide. | |
| Solder Paste / Tin Wire / Tin Bar | lead- en leadfrije (RoHS-kompatibel) PCBA-ferwurkingstsjinsten.En leverje ek oanpaste soldeerpasta. | |
| Stencil | laser cutting stencil om te soargjen dat komponinten lykas lytse-pitch ICs en BGA te foldwaan IPC-2 Class of heger. | |
| MOQ | 1 stik, mar wy advisearje ús klanten om op syn minst 5 samples te produsearjen foar har eigen analyze en testen. | |
| Component Grutte | • Passive komponinten: wy binne goed te passen de inch 01005 (0.4mm * 0.2mm), 0201 sokke lytse komponinten. | |
| • High-precision ICs lykas BGA: Wy kinne detect BGA komponinten mei Min 0.25mm spacing troch X-ray. | ||
| Component Package | reel, snijtape, buizen, en pallets foar SMT-komponinten. | |
| Maksimum Mount Accuracy of Components (100FP) | De krektens is 0,0375 mm. | |
| Solderable PCB Type | PCB (FR-4, metalen substraat), FPC, Rigid-flex PCB, Aluminium PCB, HDI PCB. | |
| Laach | 1-30 (laach) | |
| Maksimum ferwurkjen gebiet | 545 x 622 mm | |
| Minimumboarddikte | 4 (laach) 0,40 mm | |
| 6 (laach) 0.60mm | ||
| 8 (laach) 0,8 mm | ||
| 10 (laach) 1.0mm | ||
| Minimum line breedte | 0.0762 mm | |
| Minimum ôfstân | 0.0762 mm | |
| Minimum meganyske diafragma | 0.15 mm | |
| Hole muorre koper dikte | 0.015 mm | |
| Metallized aperture tolerânsje | ± 0,05 mm | |
| Net-metallisearre diafragma | ± 0.025 mm | |
| Hole tolerânsje | ± 0,05 mm | |
| Dimensionale tolerânsje | ± 0.076 mm | |
| Minimum solder brêge | 0.08mm | |
| Isolaasje ferset | 1E+12Ω (normaal) | |
| Plate dikte ratio | 1:10 | |
| Thermyske skok | 288 ℃ (4 kear yn 10 sekonden) | |
| Ferfoarme en bûgd | ≤0,7% | |
| Anti-elektrisiteit sterkte | ~1.3KV/mm | |
| Anti-stripping sterkte | 1.4N/mm | |
| Solder resist hurdens | ≥6H | |
| Flammefertraging | 94V-0 | |
| Impedânsje kontrôle | ± 5% | |
| Triemformaat | BOM, PCB Gerber, Pick and Place. | |
| Testen | Foar levering sille wy in ferskaat oan testmetoaden tapasse op de PCBA yn berch of al monteard: | |
| • IQC: ynkommende ynspeksje; | ||
| • IPQC: yn-produksje ynspeksje, LCR test foar it earste stik; | ||
| • Visual QC: routine kwaliteit kontrôle; | ||
| • AOI: soldering effekt fan patch komponinten, lytse dielen of polarity fan komponinten; | ||
| • X-Ray: check BGA, QFN en oare hege presyzje wurdt ferburgen PAD komponinten; | ||
| • Funksjonele testen: Testfunksje en prestaasjes neffens de testprosedueres en prosedueres fan 'e klant om te garandearjen neilibjen. | ||
| Reparaasje & Rework | Us BGA Repair Service kin feilich fuortsmite ferkeard pleatst, off-posysje, en ferfalske BGA en opnij hechtsje se oan 'e PCB perfekt. | |
